Display device

ABSTRACT

A display device includes: a substrate including an opening defined therein, a display area adjacent to the opening, and a non-display area extended along the opening to be disposed between the opening and the display area; a display element with which an image is displayed, on the substrate in the display area thereof; and a metal layer including a plurality of segments spaced apart from each other, each segment disposed in the non-display area of the substrate.

This application claims priority to Korean Patent Application No.10-2018-0119312, filed on Oct. 5, 2018, and all the benefits accruingtherefrom under 35 U.S.C. § 119, the disclosure of which is incorporatedherein in its entirety by reference.

BACKGROUND 1. Field

One or more embodiments relate to a display device, and moreparticularly, to a display device including an opening area.

2. Description of the Related Art

Purposes of a display device have become more diversified. Also, asdisplay devices have become thinner and more lightweight, their range ofuse has gradually been extended.

As an area occupied by a display area of a display device increases,functions that may be combined or associated with the display device arebeing added. As a way of adding various functions while increasing thedisplay area, research into a display device including an opening in thedisplay area is under progress.

SUMMARY

One or more embodiments include a display device including an openingarea or an opening that is at least partially surrounded by a displayarea.

Additional features will be set forth in part in the description whichfollows and, in part, will be apparent from the description, or may belearned by practice of the presented embodiments.

According to one or more embodiments, a display device includes: asubstrate including a first area, a second area adjacent to the firstarea, and a third area between the first area and the second area; adisplay element with which an image is displayed, on the substrate inthe second area thereof; and a metal layer including a plurality ofsegments spaced apart from each other, each segment disposed in thethird area.

The metal layer may include a metal having a light-blockingcharacteristic.

The plurality of segments may be arranged spaced apart from each otheralong an outer edge of the first area.

The display device may further include: a signal wiring portion being inthe third area. The signal wiring portion may be interposed between themetal layer and the substrate.

The display device may further include a scan signal line or a datasignal line connected to the display element in the second area. Thescan signal line or the data signal line may extend from the second areato dispose a portion of the scan signal line or the data signal line inthe third area, and the portion of the scan signal line or the datasignal line in the third area may define the signal wiring portion inthe third area.

The display device may further include: an input sensing layer on thedisplay element, the input sensing layer including first sensingelectrodes arranged along a first direction and second sensingelectrodes arranged along a second direction which intersects with thefirst direction.

The metal layer and the first sensing electrodes may respectively beportions of a same material layer, or the metal layer and the secondsensing electrodes may respectively be portions of a same materiallayer.

The plurality of segments may include a first segment electricallyconnected to one of the first sensing electrodes and a second segmentelectrically connected to one of the second sensing electrodes.

The first segment may be closer to the first sensing electrode than thesecond sensing electrode.

According to one or more embodiments, a display device includes: asubstrate including a display area in which are defined: an opening; anda non-display area between the opening and the display area; a pluralityof display elements in the display area and including a first displayelement and a second display element which are spaced apart each otherwith the opening therebetween; a signal wiring in the non-display area,the signal wiring electrically connected to the first and second displayelements; and a metal layer in the non-display area.

The metal layer may at least partially overlap the signal wiring in thenon-display area.

The metal layer may include a plurality of segments spaced apart fromeach other along an outer edge of the opening.

The display device may further include: an input sensing layer on thedisplay elements, the input sensing layer including first sensingelectrodes along a first direction and second sensing electrodes whichintersects with the first direction.

The metal layer and the first sensing electrodes may respectively beportions of a same material layer, or the metal layer and the secondsensing electrodes may respectively be portions of a same materiallayer.

According to one or more embodiments, a display device includes: asubstrate including a display area in which are defined: an opening; anda non-display area between the opening and the display area; a pluralityof display elements in the display area and with which an image isdisplayed, the display elements arranged along the opening; an inputsensing layer on the display elements; and a metal layer in thenon-display area.

The input sensing layer may include first sensing electrodes arrangedalong a first direction and second sensing electrodes arranged along asecond direction which intersects with the first direction, and themetal layer may include a segment connected to one of the first sensingelectrodes or one of the second sensing electrodes.

The metal layer may include a plurality of segments.

A first sensing electrode among the first sensing electrodes and asecond sensing electrode among the second sensing electrodes may bearranged adjacent to each other along the opening. The plurality ofsegments may include a first segment connected to the first sensingelectrode, and a second segment connected to the second sensingelectrode.

The plurality of segments may be spaced apart from each other along anouter edge of the opening.

The metal layer and the input sensing layer may be respective portionsof a same material layer.

BRIEF DESCRIPTION OF THE DRAWINGS

These and/or other features will become apparent and more readilyappreciated from the following description of the embodiments, taken inconjunction with the accompanying drawings in which:

FIG. 1 is a perspective view of an embodiment of a display device;

FIG. 2 is a cross-sectional view of an embodiment of the display devicetaken along line II-II′ of FIG. 1;

FIG. 3 is a top plan view of an embodiment of a display panel of adisplay device;

FIG. 4 is an equivalent circuit diagram of an embodiment of a pixel of adisplay panel;

FIG. 5 is an enlarged top plan view of an embodiment of a portion of adisplay panel;

FIG. 6 is an enlarged top plan view of another embodiment of a portionof a display panel;

FIG. 7 is a top plan view of an embodiment of an input sensing layer ofa display panel;

FIG. 8 is a cross-sectional view of the input sensing layer taken alongline VIII-VIII′ of FIG. 7;

FIG. 9A is an enlarged top plan view of an embodiment of a firstconductive layer of the input sensing layer of FIG. 8;

FIGS. 9B_1, 9B_2 and 9B_3 are enlarged top plan views of an embodimentof a second conductive layer of the input sensing layer of FIG. 8;

FIG. 10 is an enlarged top plan view an embodiment of an opening andarea adjacent thereto of a display device;

FIG. 11 is an enlarged top plan view of an embodiment of region XI ofFIG. 10;

FIG. 12 is a cross-sectional view taken along line XII-XII′ of FIG. 11;

FIGS. 13A and 13B are enlarged top plan views of modified embodiments ofa metal layer and sensing electrodes of a display device;

FIG. 14 is a cross-sectional view of an embodiment of a display device;

FIG. 15 is an enlarged top plan view of an embodiment of a portion of adisplay device;

FIG. 16 is an enlarged top plan view of an embodiment of a metal layerand an input sensing layer of the display device of FIG. 15.

DETAILED DESCRIPTION

As the disclosure allows for various changes and numerous embodiments,exemplary embodiments will be illustrated in the drawings and describedin detail in the written description. An effect and a characteristic ofthe disclosure, and a method of accomplishing these will be apparentwhen referring to embodiments described with reference to the drawings.This disclosure may, however, be embodied in many different forms andshould not be construed as limited to the exemplary embodiments setforth herein.

Hereinafter, the disclosure will be described more fully with referenceto the accompanying drawings, in which exemplary embodiments of thedisclosure are shown. When description is made with reference to thedrawings, like reference numerals in the drawings denote like orcorresponding elements, and repeated description thereof will beomitted.

As used herein, the term “and/or” includes any and all combinations ofone or more of the associated listed items.

Expressions such as “at least one of” when preceding a list of elements,modify the entire list of elements and do not modify the individualelements of the list. For example, “at least one of a, b or c” may beunderstood that only a, only b, only c, both a and b, both a and c, bothb and c, all of a, b, and c, or variations thereof.

It will be understood that although the terms “first”, “second”, etc.may be used herein to describe various components, these componentsshould not be limited by these terms. These components are only used todistinguish one component from another.

As used herein, the singular forms “a,” “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise.

It will be further understood that the terms “comprises/includes” and/or“comprising/including” used herein specify the presence of statedfeatures or components, but do not preclude the presence or addition ofone or more other features or components.

It will be understood that when a layer, region, or component isreferred to as being related to another element such as being “on”another layer, region, or component, it can be directly or indirectly onthe other layer, region, or component. That is, for example, interveninglayers, regions, or components may be present between the elements. Incontrast, when a layer, region, or component is referred to as beingrelated to another element such as being “directly on” another layer,region, or component, no intervening layers, regions, or components arepresent.

Sizes of elements in the drawings may be exaggerated for convenience ofexplanation. In other words, since sizes and thicknesses of componentsin the drawings are arbitrarily illustrated for convenience ofexplanation, the following embodiments are not limited thereto.

Exemplary embodiments are described herein with reference to crosssection illustrations that are schematic illustrations of idealizedembodiments. As such, variations from the shapes of the illustrations asa result, for example, of manufacturing techniques and/or tolerances,are to be expected. Thus, embodiments described herein should not beconstrued as limited to the particular shapes of regions as illustratedherein but are to include deviations in shapes that result, for example,from manufacturing. For example, a region illustrated or described asflat may, typically, have rough and/or nonlinear features. Moreover,sharp angles that are illustrated may be rounded. Thus, the regionsillustrated in the figures are schematic in nature and their shapes arenot intended to illustrate the precise shape of a region and are notintended to limit the scope of the present claims.

When a certain embodiment may be implemented differently, a specificprocess order may be performed differently from the described order. Forexample, two consecutively described processes may be performedsubstantially at the same time or performed in an order opposite to thedescribed order.

“About” or “approximately” as used herein is inclusive of the statedvalue and means within an acceptable range of deviation for theparticular value as determined by one of ordinary skill in the art,considering the measurement in question and the error associated withmeasurement of the particular quantity (i.e., the limitations of themeasurement system). For example, “about” can mean within one or morestandard deviations, or within ±30%, 20%, 10% or 5% of the stated value.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure belongs. It willbe further understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art and thepresent disclosure, and will not be interpreted in an idealized oroverly formal sense unless expressly so defined herein.

One or more embodiments may reduce or effectively prevent a wiring, etc.arranged outside a display area of a display device from being viewedfrom outside the display device due to external light being reflected atsuch wiring, etc. However, it should be understood that effectsdescribed herein should be considered in a descriptive sense only andnot for limitation of the disclosure.

It will be understood that when a layer, region, or component isreferred to as being “connected” to another layer, region, or component,it may be “directly connected” to the other layer, region, or componentor may be “indirectly connected” to the other layer, region, orcomponent with other layer, region, or component interposedtherebetween. For example, it will be understood that when a layer,region, or component is referred to as being “connected to orelectrically connected” to another layer, region, or component, it maybe “directly electrically connected” to the other layer, region, orcomponent by having no intervening layer, region, or componenttherebetween or may be “indirectly connected or electrically connected”to other layer, region, or component with another layer, region, orcomponent interposed therebetween.

FIG. 1 is a perspective view of an embodiment of a display device 1.

Referring to FIG. 1, the display device 1 includes a display area DA atwhich the display device 1 emits light and a non-display area NDA atwhich the display device 1 does not emit light. That is, an image may bedisplayed at the display area DA while not being displayed at thenon-display area NDA. The non-display area NDA is arranged adjacent tothe display area DA along a plane defined by two directions which crosseach other. The display device 1 may provide a predetermined image byusing light emitted from a pixel arranged in plurality within thedisplay area DA.

The display device 1 includes an opening area (or a first area) OA thatis at least partially surrounded by the display area (or a second area)DA. In an embodiment, FIG. 1 shows that the opening area OA is entirelysurrounded by the display area DA. The non-display area NDA may includea first non-display area NDA1 (or a third area, a middle area betweenthe first area and the second area) surrounding the opening area OA, anda second non-display area NDA2 (or a fourth area, a peripheral area)surrounding an outer periphery of the display area DA. The firstnon-display area NDA1 may entirely surround the opening area OA, thedisplay area DA may entirely surround the first non-display area NDA1,and the second non-display area NDA2 may entirely surround the displayarea DA. The opening area OA, the display area DA and the non-displayarea NDA may together define or correspond to an entire planar area of afront (or viewing) surface of the display device 1. The opening area OA,the display area DA and the non-display area NDA described above for thedisplay device 1 may also be applied to corresponding areas ofcomponents within the display device 1.

Though an organic light-emitting display device is exemplarily describedas the display device 1 according to an embodiment below, the displaydevice 1 is not limited thereto. In another embodiment, various types ofdisplay devices such as an inorganic light-emitting display and aquantum dot light-emitting display may be used.

FIG. 2 is a cross-sectional view of an embodiment of a display deviceand corresponds to a cross-section taken along line II-II′ of FIG. 1.

Referring to FIG. 2, the display device 1 may include a display panel10, an input sensing layer 40 arranged on the display panel 10, and anoptical functional layer (or anti-reflection layer) 50. These layers maybe covered by a window 60. The display device 1 may represent or includevarious electronic devices such as mobile phones, notebook computers,and smartwatches. The window 60 may form an outer surface of the displaydevice 1, such as the front (or viewing) surface of the display device1.

The display panel 10 may display an image. The display panel 10 includesa pixel arranged in plurality within the display area DA. Each of thepixels may include a display element and a pixel circuit which isconnected thereto. The display element may include an organiclight-emitting diode, an inorganic light-emitting diode, or a quantumdot light-emitting diode. The display element under control of the pixelcircuit may generate and/or emit light to generate an image for displayby the display device 1.

The input sensing layer 40 obtains coordinate information correspondingto an external input, for example, a touch event. The input sensinglayer 40 may include a sensing electrode (or a touch electrode) and asignal line which is connected to the sensing electrode. The inputsensing layer 40 may be arranged on the display panel 10.

The input sensing layer 40 may be directly formed on the display panel10 or may be formed separately and then coupled by using an adhesivelayer such as an optical clear adhesive (“OCA”). In an embodiment, forexample, layers or elements of the input sensing layer 40 may besuccessively formed on the display panel 10 after a process of formingthe display panel 10, such that the input sensing layer 40 is directlyformed on the display panel 10. In this case, the adhesive layer may notbe arranged between the input sensing layer 40 and the display panel 10.Though FIG. 2 shows that the input sensing layer 40 is arranged betweenthe display panel 10 and the optical functional layer 50, the opticalfunctional layer 50 may be between the input sensing layer 40 and thedisplay panel 10 in another embodiment.

The optical functional layer 50 may include a reflection preventionlayer. The reflection prevention layer may reduce reflectivity of light(external light) incident from outside the display device 1 and towardthe display panel 10 through the window 60. The reflection preventionlayer may include a retarder and a polarizer. The retarder may include afilm type retarder or a liquid crystal type retarder. The retarder mayinclude a λ/2 retarder and/or a λ/4 retarder. The polarizer may includea film type polarizer or a liquid crystal type polarizer. The film typepolarizer may include a stretchable synthetic resin film, and the liquidcrystal type polarizer may include liquid crystals arranged in apredetermined arrangement. Each of the retarder and the polarizer mayfurther include a protective film. The retarder and the polarizerthemselves or their protective films may be defined as a base layer ofthe reflection prevention layer.

In another embodiment, the reflection prevention layer may include ablack matrix and color filters. The color filters may be arranged takinginto account colors of light emitted respectively from pixels of thedisplay panel 10. In another embodiment, the reflection prevention layermay include a cancelling interference structure. The cancellinginterference structure may include a first reflection layer and a secondreflection layer respectively arranged in different layers. Firstreflected light and second reflected light respectively reflected by thefirst reflection layer and the second reflection layer may createdestructive-interference and thus reflectivity of external light may bereduced.

The optical functional layer 50 may include a lens layer. The lens layermay improve emission efficiency of light emitted from the display panel10 or reduce color deviation of the light. The lens layer may include alayer having a concave or convex lens shape and/or include a pluralityof layers respectively having different refractive indexes. The opticalfunctional layer 50 may include both the reflection prevention layer andthe lens layer or include only one among the reflection prevention layerand the lens layer.

The display panel 10, the input sensing layer 40, and/or the opticalfunctional layer 50 may include an opening defined therein. With regardto this, FIG. 2 shows that the display panel 10, the input sensing layer40, and the optical functional layer 50 respectively include first tothird openings 10H, 40H, and 50H defined therein and that the first tothird openings 10H, 40H, and 50H thereof overlap each other tocollectively form a single opening. The first to third openings 10H,40H, and 50H are located to correspond to the opening area OA of thedisplay device 1. In another embodiment, at least one of the displaypanel 10, the input sensing layer 40, or the optical functional layer 50may not include an opening at the opening area OA. In an embodiment, forexample, one or two among the display panel 10, the input sensing layer40, and the optical functional layer 50 may not include an opening.Hereinafter, the opening area OA may denote at least one of the first tothird openings 10H, 40H, or 50H respectively of the display panel 10,the input sensing layer 40, and the optical functional layer 50. In anembodiment, for example, in the present specification, the opening areaOA may denote the first opening 10H of the display panel 10.

A component 20 of the display device 1 may correspond to an opening areaOA. As shown by a solid line of FIG. 2, the component 20 may be locatedinside the first to third openings 10H, 40H, and 50H, or as shown by adashed line, the component 20 may be located below the display panel 10at an outside thereof but corresponding to allocation of the openingarea OA.

The component 20 may include an electronic element. In an embodiment,for example, the component 20 may include an electronic element thatuses light or sound to perform a function, etc. In an embodiment, forexample, the electronic element may be a sensor such as an infraredsensor that emits and/or receives light, a camera that receives lightand captures an image, a sensor that outputs and senses light or soundsto measure a distance or recognize a fingerprint relative to the displaydevice 1, a relatively small lamp that outputs light, and/or a speakerthat outputs sounds. An electronic element that uses light may use lightin various wavelength bands such as visible light, infrared light, andultraviolet light.

In an embodiment, the opening area OA may be understood as atransmission area through which light and/or sounds, which are outputfrom the component 20 to outside thereof or through which light and/orsounds, which propagate toward the electronic element from the outsidemay pass. At the opening area OA, the component 20 and/or any of thelayers in which an opening is defined may be exposed to the window 60.That is, the component 20 and/or any of the layers in which an openingis defined may not be exposed to outside the overall display device 1since the window 60 does not include an opening corresponding to theopening area OA.

In another embodiment, in the case where the display device 1 is used asa smartwatch or an instrument panel for an automobile, the component 20may be a member including a needle of a clock or a needle, etc.indicating predetermined information (e.g. the velocity of a vehicle,etc.). In the case where the display device 1 includes a needle of aclock or an instrument panel for an automobile, the component 20 may beexposed to outside the overall display device 1 through the window 60,which may include an opening corresponding to the opening area OA.

As described above, the component 20 may include element(s) related to afunction of the display panel 10 or an element such as an accessory thatincreases an esthetic sense of the display panel 10.

Though FIG. 2 shows that the window 60 is spaced apart from the opticalfunctional layer 50 by a predetermined interval, a layer including anoptical transparent adhesive, etc. may be located between the window 60and the optical functional layer 50.

FIG. 3 is a top plan view of an embodiment of a display panel of adisplay device, and FIG. 4 is an equivalent circuit diagram of anembodiment of a pixel of a display panel.

Referring to FIG. 3, the display panel 10 includes the display area DAand the first and second non-display areas NDA1 and NDA2. FIG. 3 may beunderstood as a view of features relative to a substrate 100 in thedisplay panel 10. In an embodiment, for example, the substrate 100 maybe understood to have the opening area OA, the first and secondnon-display areas NDA1 and NDA2. Though not shown, the substrate 100 mayinclude an opening corresponding to the opening area OA, for example, anopening that passes completely through a thickness of the substrate 100from a top surface thereof to a bottom surface thereof as describedbelow in FIG. 14.

The display panel 10 includes a pixel P arranged in plurality in thedisplay area DA. As shown in FIG. 4, each pixel P includes a pixelcircuit PC and an organic light-emitting diode OLED as a display elementwhich is connected to the pixel circuit PC. In an embodiment, the pixelP, the pixel circuit PC, and elements of each of these features may beprovided in plurality on the substrate 100. The pixel circuit PC mayinclude a first thin film transistor T1, a second thin film transistorT2, and a storage capacitor Cst. Each pixel P may emit, for example,red, green, blue, or white light through the organic light-emittingdiode OLED.

The second thin film transistor T2 is a switching thin film transistor,may be connected to a scan line SL and a data line DL, and may transfera data voltage that is input from the data line DL to the first thinfilm transistor T1 in response to a switching voltage input from thescan line SL. The storage capacitor Cst may be connected to the secondthin film transistor T2 and a driving voltage line PL and may store avoltage corresponding to a difference between a voltage transferred fromthe second thin film transistor T2 and a first power voltage ELVDDsupplied to the driving voltage line PL.

The first thin film transistor T1 is a driving thin film transistor, maybe connected to the driving voltage line PL and the storage capacitorCst, and may control an electrical driving current flowing through theorganic light-emitting diode OLED from the driving voltage line PL inresponse to a voltage value stored in the storage capacitor Cst. Theorganic light-emitting diode OLED may emit light having predeterminedbrightness by using the driving current. An opposite electrode (e.g. acathode) of the organic light-emitting diode OLED may receive a secondpower voltage ELVSS.

Though it is described with reference to FIG. 4 that the pixel circuitPC includes two thin film transistors and one storage capacitor, thepresent disclosure is not limited thereto. The number of thin filmtransistors and/or the number of storage capacitors may be variouslychanged depending on a design of the pixel circuit PC.

Referring to FIG. 3 again, the first non-display area NDA1 may surroundthe opening area OA. The first non-display area NDA1 is an area in whicha display element such as an organic light-emitting diode OLED is notarranged. Signal lines that provide a signal to pixels P provided aroundthe opening area OA may pass across, or groove(s), which will bedescribed below, may be arranged in the first non-display area NDA1. Ascan driver 1100 that provides a scan signal to each pixel P, a datadriver 1200 that provides a data signal to each pixel P, a conductivemain power wiring (not shown) that provides first and second powervoltages ELVDD and ELVSS, etc. may be arranged in the second non-displayarea NDA2. Though FIG. 3 shows the data driver 1200 is adjacent to onelateral side of the substrate 100, the data driver 1200 may be arrangedon a flexible printed circuit board (“FPCB”) (not shown) electricallyconnected to a pad (not shown) of the display panel 10 arranged on oneside of the display panel 10 according to another embodiment.

FIG. 5 is an enlarged top plan view of an embodiment of a portion of thedisplay panel 10 and shows conductive wirings, for example, signal lineslocated in the first non-display area NDA1.

Referring to FIG. 5, pixels P may be arranged around the opening area OAin the display area DA, and the first non-display area NDA1 may belocated between the opening area OA and the display area DA.

Pixels P may be spaced apart from each other around the opening area OA.The opening area OA may be located between pixels P. In an embodiment,for example, the pixels P may be arranged up and down with the openingarea OA therebetween and/or arranged left and right with the openingarea OA therebetween.

Signal lines that are adjacent to the opening area OA among signal linesthat supply a signal to the pixels P may detour around the opening areaOA. That is, a signal line outside of the first non-display area NDA1may have an extension direction, but at the first non-display area NDA1,the signal line may deviate from the extension direction such that thesignal line detours around the opening area OA. Some data lines DL amongdata lines DL that pass across the display area DA may extend in ay-direction, provide a data signal to the pixels P arranged along they-direction with the opening area OA therebetween, and detour along anedge of the opening area OA in the first non-display area NDA1. Somescan lines SL among scan lines SL that pass across the display area DAmay extend in an x-direction, provide a scan signal to the pixels Parranged along the x-direction with the opening area OA therebetween,and detour along an edge of the opening area OA in the first non-displayarea NDA1.

The display device 1 and components thereof may be disposed in a planewhich is parallel to a plane defined by the x-direction and they-direction crossing each other. A thickness of the display device 1 andcomponents thereof extends along a z-direction which crosses each of thex-direction and y-direction.

FIG. 6 is an enlarged top plan view of another embodiment of a portionof the display panel 10 and shows a metal layer and signal lines locatedin the first non-display area NDA1.

Referring to FIG. 6, a metal layer 30 is arranged in the firstnon-display area NDA1 surrounding the opening area OA. A width (radialwidth) W1 of the metal layer 30 may be less than a width (radial width)W0 of the first non-display area NDA1. Alternatively, the width W1 ofthe metal layer 30 may be the same as the width W0 of the firstnon-display area NDA1. Here, the width W1 of the metal layer 30 and thewidth W0 of the first non-display area NDA1 may represent distances in aradial direction from a center CO of the opening area OA.

The metal layer 30 may include a metal as a material that does nottransmit light, that is, having a light-blocking characteristic. In anembodiment, for example, the metal layer 30 may include Mo, Al, Cu,and/or Ti. The metal layer 30 may include a multi-layer structure or asingle layer structure including one or more of the above-mentionedmaterials. In an embodiment, the metal layer 30 may include amulti-layer structure of Ti/Al/Ti.

The metal layer 30 may at least partially cover signal lines arrangedthereunder, for example, the data lines DL and/or the scan lines SLdescribed with reference to FIG. 5. Light incident from the outsidetoward the display panel 10 may be reflected by the data lines and/orthe scan lines which are not covered by a light-blocking element.However, according to one or more embodiment, the metal layer 30 mayreduce or effectively prevent light reflected by the data lines DLand/or the scan lines SL from being provided or viewable to a useroutside the display panel 10 by blocking the light progressing fromoutside the display panel 10 (or the display device 1) toward the datalines DL and/or the scan lines SL.

The metal layer 30 may collectively include a plurality of segments.With regard to this, though FIG. 6 shows that the metal layer 30includes first to seventh segments 310, 320, 330, 340, 350, 360, and370, the present disclosure is not limited thereto. The metal layer 30may include two or more segments and the number of segments may bevariously changed.

The first to seventh segments 310, 320, 330, 340, 350, 360, and 370 maybe arranged in a circumferential direction that surrounds an edge of theopening area OA. The first to seventh segments 310, 320, 330, 340, 350,360, and 370 may be spaced apart from each other along thecircumferential direction.

In an embodiment of manufacturing a display device, the metal layer 30may be simultaneously formed during a process of forming the inputsensing layer 40 described with reference to FIG. 2. The metal layer 30and the input sensing layer 40 may be disposed in a same layer of thedisplay device 1 among layers thereof. As being ‘in same layer’ or‘simultaneously formed,’ features may respectively be portions of a samematerial layer. With regard to a structure of the metal layer 30, theinput sensing layer 40 is described first and then the structure of themetal layer 30 is described below.

FIG. 7 is a top plan view of an embodiment of the input sensing layer 40on the display panel 10, FIG. 8 is a cross-sectional view of the inputsensing layer 40 taken along line VIII-VIII′ of FIG. 7, FIG. 9A is anenlarged top plan view of an embodiment of a first conductive layer CML1of the input sensing layer 40 of FIG. 8, and FIGS. 9B_1, 9B_2 and 9B_3are enlarged top plan views of an embodiment of a second conductivelayer CML2 of the input sensing layer 40 of FIG. 8. FIGS. 9B_2 and 9B_3are respectively views of regions A and B shown in FIG. 9B_1.

Referring to FIG. 7, the input sensing layer 40 may include firstsensing electrodes 410, first trace lines 415-1, 415-2, 415-3, and 415-4connected to the first sensing electrodes 410, second sensing electrodes420, and second trace lines 425-1, 425-2, 425-3, 425-4, and 425-5connected to the second sensing electrodes 420. The input sensing layer40 may sense an external pressure thereto by using a mutual cap methodand/or a self-cap method. In embodiments, a voltage applied to the firstsensing electrodes 410 may be different from a voltage applied to thesecond sensing electrodes 420, within the input sensing layer 40.

The first sensing electrodes 410 may be arranged in the y-direction, andthe second sensing electrodes 420 may be arranged in the x-directionthat intersects or crosses the y-direction. The first sensing electrodes410 arranged in the y-direction may be connected to each other by afirst connection electrode 411 between neighboring first sensingelectrodes 410 and together may respectively constitute first sensinglines 410C1, 410C2, 410C3, and 410C4 lengthwise extended along they-direction. The second sensing electrodes 420 arranged in thex-direction may be connected to each other by a second connectionelectrode 421 between neighboring second sensing electrodes 420 andtogether may respectively constitute second sensing lines 420R1, 420R2,420R3, 420R4, and 420R5 lengthwise extended along the x-direction. Thefirst sensing lines 410C1, 410C2, 410C3, and 410C4, and the secondsensing lines 420R1, 420R2, 420R3, 420R4, and 420R5 may intersect eachother. In an embodiment, for example, the first sensing lines 410C1,410C2, 410C3 and 410C4, and the second sensing lines 420R1, 420R2,420R3, 420R4 and 420R5 may be perpendicular to each other.

The first sensing lines 410C1, 410C2, 410C3 and 410C4, and the secondsensing lines 420R1, 420R2, 420R3, 420R4 and 420R5 may be arranged inthe display area DA and connected to a sensing signal pad 440 throughthe first trace lines 415-1, 415-2, 415-3, and 415-4 and the secondtrace lines 425-1, 425-2, 425-3, 425-4, and 425-5 formed in the secondnon-display area NDA2. The first sensing lines 410C1, 410C2, 410C3 and410C4 may be respectively connected to the first trace lines 415-1,415-2, 415-3, and 415-4. The second sensing lines 420R1, 420R2, 420R3,420R4 and 420R5 may be respectively connected to the second trace lines425-1, 425-2, 425-3, 425-4, and 425-5.

FIG. 7 shows that each of the first trace lines 415-1, 415-2, 415-3, and415-4 is connected to a top side and a bottom side of the first sensinglines 410C1, 410C2, 410C3 and 410C4, and sensing sensitivity may beimproved through this structure. However, the present disclosure is notlimited thereto. In another embodiment, the first trace lines 415-1,415-2, 415-3, and 415-4 may be connected to only the top side or thebottom side of the first sensing lines 410C1, 410C2, 410C3 and 410C4.The arrangement shape of the first trace lines 415-1, 415-2, 415-3, and415-4 and the second trace lines 425-1, 425-2, 425-3, 425-4, and 425-5may be variously changed depending on the shape, size of the displayarea DA or a sensing method, etc. of the input sensing layer 40.

Planar areas of a first group of the first and second sensing electrodes410 and 420 that are adjacent to (e.g., closest to) the opening area OAmay be less than planar areas of a second group of the first and secondsensing electrodes 410 and 420 which are further away from the openingarea OA than the first group. The metal layer 30 arranged in acircumferential direction that surrounds the opening area OA may includethe same material as that of one of the first and second sensingelectrodes 410 and 420 and may be formed during the same process as aprocess of forming the first and second sensing electrodes 410 and 420so as to respectively be portions of a same material layer.

The input sensing layer 40 may include a plurality of conductive layerseach including a conductive material. Referring to FIG. 8, the inputsensing layer 40 may collectively include the first conductive layerCML1 and the second conductive layer CML2 arranged over the displaypanel 10. A first insulating layer 41 may be arranged between the firstconductive layer CML1 and the display panel 10, a second insulatinglayer 43 may be arranged between the first conductive layer CML1 and thesecond conductive layer CML2, and a third insulating layer 45 may bearranged on the second conductive layer CML2.

In an embodiment, the first and second insulating layers 41 and 43 mayinclude an inorganic insulating layer such as silicon nitride, and thethird insulating layer 45 may include an organic insulating layer.Though FIG. 8 shows that the first insulating layer 41 is arrangedbetween the display panel 10 and the first conductive layer CML1, thefirst insulating layer 41 may be omitted and the first conductive layerCML1 may be located directly on the display panel 10 in anotherembodiment. In another embodiment, the first and second insulatinglayers 41 and 43 may include an organic insulating layer.

As shown in FIGS. 8 and 9A, the first conductive layer CML1 may includethe first connection electrodes 411. As shown in FIGS. 8 and 9A, thesecond conductive layer CML2 may include the first sensing electrodes410, the second sensing electrodes 420, and the second connectionelectrodes 421. The second sensing electrodes 420 may be connected toeach other by the second connection electrodes 421 disposed or formed inthe same layer as that of the second sensing electrodes 420. The firstsensing electrodes 410 may be connected to each other by the firstconnection electrodes 411 formed in a layer different from that of thefirst sensing electrodes 410. The first connection electrodes 411 thatelectrically connect neighboring first sensing electrodes 410 may beconnected to the neighboring first sensing electrodes 410 through acontact hole CNT formed in the second insulating layer 43.

The first and second conductive layers CML1 and CML2 may include a metalmaterial. In an embodiment, for example, the first and second conductivelayers CML1 and CML2 may include Mo, Al, Cu, and/or Ti and may include amulti-layer structure or a single layer structure including theabove-mentioned materials. In an embodiment, the first and secondconductive layers CML1 and CML2 may include a multi-layer structure ofTi/Al/Ti.

Referring to FIG. 9B_3 as an enlarged view of region B FIG. 9B_1, asingle one first sensing electrode 410 may have a conductive gridstructure (or a mesh structure, a lattice structure, etc.) including ordefined with a plurality of holes 410H. Each of the holes 410H mayoverlap an emission area P-E of a pixel. Similarly, referring to FIG.9B_2 as an enlarged view of region A FIG. 9B_1, a single one secondsensing electrode 420 may have a conductive grid structure (or a latticestructure) including or defined with a plurality of holes 420H. Each ofthe holes 420H may overlap an emission area P-E of a pixel.

The metal layer 30 shown in FIG. 7 may be simultaneously formed during aprocess of forming one of the first conductive layer CML1 and the secondconductive layer CML2. In an embodiment, for example, the metal layer 30may be formed during a process of forming the second conductive layerCML2. In this case, the metal layer 30 may be located in a same layer inwhich the first sensing electrode 410, the second sensing electrode 420,and/or the second connection electrode 421 are arranged and may includethe same material as that of the first sensing electrode 410, the secondsensing electrode 420, and/or the second connection electrode 421. Inanother embodiment, the metal layer 30 may be formed during a process offorming the first conductive layer CML1. In this case, the metal layer30 may be located in a same layer in which the first connectionelectrode 411 is arranged and may include the same material as that ofthe first connection electrode 411.

Though it is described with reference to FIGS. 8, 9B_1, 9B_2 and 9B_3that the first sensing electrodes 410 and the first connectionelectrodes 411 are arranged in different layers from each other, thepresent disclosure is not limited thereto. In another embodiment, thefirst sensing electrodes 410 and the first connection electrodes 411 maybe arranged in a same layer (e.g. the second conductive layer), and thesecond sensing electrodes 420 and the second connection electrodes 421may be arranged in different layers from each other and connectedthrough a contact hole that passes through the second insulating layer43.

Though it is described with reference to FIGS. 8, 9B_1, 9B_2 and 9B_3that the first and second sensing electrodes 410 and 420 are included ina same one of the second conductive layer CML2, the present disclosureis not limited thereto. In another embodiment, the first sensingelectrode 410 and the second sensing electrode 420 may be arranged indifferent layers from each other. In an embodiment, for example, one ofthe first sensing electrode 410 and the second sensing electrode 420 maybe disposed or formed in the first conductive layer CML1, and the othermay be disposed or formed in the second conductive layer CML2.

FIG. 10 is an enlarged top plan view of an embodiment of an opening ofthe display device 1 and area adjacent thereto, FIG. 11 is an enlargedtop plan view of region XI of FIG. 10, and FIG. 12 is a cross-sectionalview taken along line XII-XII′ of FIG. 11.

Referring to FIG. 10, the metal layer 30 may include the first toseventh segments 310, 320, 330, 340, 350, 360, and 370. The first toseventh segments 310, 320, 330, 340, 350, 360, and 370 may be spacedapart from each other with a predetermined interval to surround theopening area OA. As described above, the metal layer 30 may be locatedin the same layer in which one of the first and second conductive layersCML1 and CML2 of the input sensing layer 40 (see FIG. 8) is arranged andmay include the same material as that of one of the first and secondconductive layers CML1 and CML2. Hereinafter, for convenience ofdescription, description is made to the case where the metal layer 30 islocated in the same layer in which the second conductive layer CML2 isarranged and includes the same material as that of the second conductivelayer CML2.

The first sensing electrodes 410 may be spaced apart from each otherwith respect to the opening area OA. The second sensing electrodes 420may be spaced apart from each other with respect to the opening area OA.Neighboring first sensing electrodes 410 and/or neighboring secondsensing electrodes 420 respectively arranged around the opening area OAmay be electrically connected to each other by a connection electrodeand/or the segments of the metal layer 30. In this regard, FIG. 10describes that neighboring first sensing electrodes 410 spaced apartfrom each other around the opening area OA may be electrically connectedto each other by the first connection electrode 411. Neighboring secondsensing electrodes 420 spaced apart from each other around the openingarea OA may be electrically connected to each other by the secondconnection electrode 421 and/or one of the segments of the metal layer30.

In an embodiment, for example, as shown in FIG. 10, neighboring firstsensing electrodes 410 that are arranged along the y-direction aroundthe opening area OA may be electrically connected to each other by firstsub-connection electrodes 411A and 411B. The first sub-connectionelectrodes 411A and 411B are elements or extensions of the firstconnection electrodes 411 and may be included in the first conductivelayer CML1 as described with reference to FIGS. 8 and 9A.

Neighboring second sensing electrodes 420 that are arranged on the upperright side and the upper left side of the opening area OA may beelectrically connected by the second connection electrode 421. Thesecond sensing electrodes 420 and the second connection electrode 421may be included in the second conductive layer CML2 as described above.

Neighboring second sensing electrodes 420 that are arranged on the lowerright side and the lower left side of the opening area OA may beelectrically connected by second sub-connection electrodes 421A and 421Band the fifth segment 350. In an embodiment, for example, the secondsub-connection electrodes 421A and 421B and the fifth segment 350 may bearranged in the second conductive layer CML2. That is, the secondsensing electrodes 420, the second sub-connection electrodes 421A and421B and the fifth segment 350 may be located in the same layer, mayinclude the same material, and may be connected to each other as onebody. As being ‘one body,’ one among the second sensing electrodes 420,the second sub-connection electrodes 421A and 421B and the fifth segment350 may extend to define a portion thereof as another one among thesecond sensing electrodes 420, the second sub-connection electrodes 421Aand 421B and the fifth segment 350.

At least one of the first to seventh segments 310, 320, 330, 340, 350,360, or 370 may be electrically connected to the first sensing electrode410 or the second sensing electrode 420. With regards to this, FIG. 10shows that each of the first to sixth segments 310 to 360 is connectedto the first sensing electrode 410 or the second sensing electrode 420.

As shown in FIGS. 10, 11 and 12, the first segment 310 may overlap oneof the first sub-connection electrodes 411A and may be electricallyconnected to the first sub-connection electrodes 411A. Referring to FIG.11, the first segment 310 may overlap first and second portions 411Aaand 411Ab of the first sub-connection electrodes 411A. Referring to FIG.12, the first segment 310 located in the same layer in which the secondconductive layer CML2 (see FIG. 8) is arranged may contact the firstsub-connection electrode 411A located in the same layer in which thefirst conductive layer CM1 (see FIG. 8) is arranged through a contacthole disposed or formed in the second insulating layer 43. The firstsegment 310 that is electrically connected to the first sub-connectionelectrode 411A that connects the first sensing electrodes 410 to eachother may form a portion of or function as the first sensing electrode410.

The second segment 320 may be electrically connected to one of thesecond sensing electrodes 420 by a connection portion 422. In anembodiment, for example, as shown in FIG. 10, the second sensingelectrode 420 on the upper left side of the opening area OA, theconnection portion 422, and the second segment 320 may be located in thesame layer in which the second conductive layer CML2 (see FIG. 8) isarranged and may be formed as one body. The second segment 320 may forma portion of or function as the second sensing electrode 420.

The third segment 330 may be electrically connected to one of the secondsensing electrodes 420 by another connection portion 423. In anembodiment, for example, as shown in FIG. 10, the second sensingelectrode 420 on the lower left side of the opening area OA, the otherconnection portion 423, and the third segment 330 may be located in thesame layer in which the second conductive layer CML2 (see FIG. 8) isarranged and may be formed as one body. The third segment 330 may form aportion of or function as the second sensing electrode 420.

Similar to the first segment 310 at the upper portion of the openingarea OA, the fourth segment 340 at the lower portion of the opening areaOA may be electrically connected to the first sub-connection electrode411A. The electrical connection between the fourth segment 340 and thefirst sub-connection electrode 411A has the same structure as thatdescribed with reference to FIG. 12. Similar to the first segment 310,the fourth segment 340 may form a portion of or function as the firstsensing electrode 410.

The fifth segment 350 may be connected to each of neighboring secondsensing electrodes 420 by the second sub-connection electrodes 421A and421B. In an embodiment, for example, as shown in FIG. 10, the fifthsegment 350 may be connected to the second sensing electrode 420 on thelower left side of the opening area OA by one second sub-connectionelectrode 421A and may be connected to the second sensing electrode 420on the lower right side of the opening area OA by the other secondsub-connection electrode 421B. The second sensing electrodes 420, thesecond sub-connection electrodes 421A and 421B, and the fifth segment350 may be disposed or formed in the same layer as each other, forexample, in the same layer in which the second conductive layer CML2(see FIG. 8) is arranged. The fifth segment 350 may form a portion of orfunction as the second sensing electrode 420 or the second connectionelectrode 421.

As shown in FIGS. 10 and 11, the sixth segment 360 may overlap the otherfirst sub-connection electrode 411B and may be electrically connected tothe first sub-connection electrode 411B. Referring to FIG. 11, the sixthsegment 360 may overlap first and second portions 411Ba and 411Bb of thefirst sub-connection electrode 411B. Similar to the description madeabove with reference to FIG. 11, the sixth segment 360 may contact thefirst and second portions 411Ba and 411Bb of the first sub-connectionelectrode 411B through a contact hole disposed or formed in the secondinsulating layer 43 (see FIG. 12). The sixth segment 360 connected tothe first sub-connection electrode 411B may form a portion of orfunction as the first sensing electrode 410.

The seventh segment 370 may include a floating electrode. In anembodiment, for example, the seventh segment 370 may include a floatingelectrode that is not electrically connected to the first sensingelectrode 410 or the second sensing electrode 420.

FIG. 11 shows a portion of the first, sixth, and seventh segments 310,360, and 370 arranged in the first non-display area NDA1. The firstsensing electrode 410 having a grid/mesh/lattice structure defined byconductive lines is shown in detail within the display area DA adjacentto the non-display area NDA1. As shown in FIG. 11, a portion of thefirst sensing electrode 410 of the display area DA may extend into thefirst non-display area NDA1 to be located in the first non-display areaNDA1.

Though FIG. 10 shows that planar areas of one first sensing electrode410 (upper central) and four second sensing electrodes 420 (closest tothe opening area OA) are different from planar areas of other sensingelectrodes due to the opening area OA, the present disclosure is notlimited thereto. The arrangement of the first and second sensingelectrodes 410 and 420 around the opening area OA may be variouslymodified and the planar areas of the first and second sensing electrodes410 and 420 may be also variously modified depending on the locationand/or the size of the opening area OA. A touch sensitivity or sensingsensitivity in the vicinity of the opening area OA may be remarkablyreduced depending on a location and/or size of the opening area OA. Inthe case where one or more of the first to seventh segments 310, 320,330, 340, 350, 360, or 370 of the metal layer 30 are connected to thefirst sensing electrode 410 or the second sensing electrode 420 asdescribed above, the segment(s) may serve as a sensing electrode andimprove the touch sensitivity in the vicinity of the opening area OA.

Though FIG. 10 shows that the planar areas (or planar sizes) of thefirst to seventh segments 310, 320, 330, 340, 350, 360, and 370 aredifferent, the present disclosure is not limited thereto. In anotherembodiment, the planar areas (or sizes) of the first to seventh segments310, 320, 330, 340, 350, 360, and 370 may be the same. The planar areas(or sizes) of the first to seventh segments 310, 320, 330, 340, 350,360, and 370 may be determined depending on the location and/or size ofthe opening area OA. The number of segments of the metal layer 30 may bevariously modified depending on the location and/or dimensions of theopening area OA.

Though FIG. 10 shows that the first, fourth, and sixth segments 310,340, and 360 connected to a first sensing electrode 410 or a secondsensing electrodes 420 respectively neighboring to the segment, thepresent disclosure is not limited thereto. In another embodiment, theelectric connection and arrangement of the segments may be variouslymodified as described below with reference to FIGS. 13A and 13B.

FIGS. 13A and 13B are enlarged top plan views of modified embodiments ofthe metal layer 30 and sensing electrodes of the display device 1. FIGS.13A and 13B show that the metal layer 30 includes six segments.

Referring to FIG. 13A, each of first to sixth segments 310′, 320′, 330′,340′, 350′, and 360′ may be electrically connected to a neighboringsensing electrode. In an embodiment, for example, each of the first andfourth segments 310′ and 340′ may be respectively electrically connectedto a neighboring first sensing electrode 410. Each of the second, third,fifth, and sixth segments 320′, 330′, 350′, and 360′ may be respectivelyelectrically connected to a neighboring second sensing electrode 420.That is, a segment arranged between the opening area OA and one of thesensing electrodes may receive the same voltage as that of thecorresponding neighboring sensing electrode.

Referring to FIG. 13B, each of first to sixth segments 310″, 320″, 330″,340″, 350″, and 360″ may be electrically connected to a sensingelectrode to which a different voltage from that of a neighboring (e.g.,closest) sensing electrode is applied. In an embodiment, for example,each of the first and fourth segments 310″ and 340″ may be electricallyconnected to a second sensing electrode 420. Each of the first andfourth segments 310″ and 340″ may be electrically connected to twosecond sensing electrodes 420. Each of the second, third, fifth, andsixth segments 320″, 330″, 350″, and 360″ may be electrically connectedto the first sensing electrode 410. Two segments among the second,third, fifth, and sixth segments 320″, 330″, 350″, and 360″ may beconnected to a same one of the first sensing electrode 410. That is, asegment arranged between the opening area OA and one of the sensingelectrodes may receive a different voltage from that of the neighboring(e.g., closest) sensing electrode.

As shown in FIGS. 13A and 13B, planar areas and sizes of sensingelectrodes that neighbor the opening area OA to be disposed closestthereto among the sensing electrodes may be different. In an embodiment,for example, a planar area or size of the second sensing electrode 420may be greater than a planar area or size of the first sensing electrode410. FIGS. 13A and 13B show that a planar area or size of a segment thatneighbors a sensing electrode having a relatively small area among thesensing electrodes around the opening area OA is greater than an area orsize of a segment that neighbors a sensing electrode having a relativelylarge area among the sensing electrodes around the opening area OA. Inan embodiment, for example, a planar area or size of the second segments320′ and 320″ that neighbor the (upper left) second sensing electrode420 having a relatively small planar area or size among all of thesensing electrodes may be greater than a planar area or size of thefirst segments 310′ and 310″ that neighbor the (upper central) firstsensing electrode 410 having a relatively large planar area or sizeamong all of the sensing electrodes. The relatively small planar areamay correspond to a sensing electrode having a reduced planar area dueto modifying an original shape of the sensing electrode to define anedge thereof corresponding to the edge of the opening area OA.Conversely, the relatively large planar area may correspond to a sensingelectrode for which an original shape (refer to FIG. 7 or 9B_1) is notmodified and is maintained even though such sensing electrode is a‘neighboring’ sensing electrode relative to the metal layer 30. However,the present disclosure is not limited thereto. In another embodiment, aplanar area or size of the second segment that neighbors the secondsensing electrode 420 having the relatively small planar area or sizemay be less than a planar area or size of the first segment thatneighbors the first sensing electrode 410 having the relatively largearea or size.

Though not separately shown in FIGS. 13A and 13B, the sensing electrodesspaced apart from each other around the opening area OA may be connectedto each other to constitute a row (e.g., extended along the x-direction)or a column (e.g., extended along the y-direction). In an embodiment,for example, the first sensing electrodes 410 above and below theopening area OA along the y-direction may be connected to each other bythe first sub-connection electrodes 411A and 411B described above withreference to FIG. 10. Likewise, the second sensing electrodes 420 on thelower right side and the lower left side of the opening area OA may beconnected to each other by the second sub-connection electrodes 421A and421B described with reference to FIG. 10, and the second sensingelectrodes 420 on the upper right side and the upper left side of theopening area OA may be also connected to each other by a sub-connectionelectrode (not shown) similar to the second sub-connection electrodes421A and 421B. Since sensing electrodes disposed along a respective rowor column may be at opposing sides of the opening area OA, since thesensing electrodes at the opposing sides are connected to each bysub-connection electrodes, the touch sensitivity in the vicinity of theopening area OA may be further improved.

FIG. 14 is a cross-sectional view of an embodiment of the display device1.

First, the display area DA of FIG. 14 is described.

The substrate 100 may include a polymer resin. The substrate 100 mayinclude a plurality of layers. In an embodiment, for example, thesubstrate 100 may include a base layer including a polymer resin, and aninorganic layer. In an embodiment, for example, the substrate 100 mayinclude a first base layer 101, a first inorganic layer 102, a secondbase layer 103, and a second inorganic layer 104 that are sequentiallystacked.

Each of the first and second base layers 101 and 103 may include apolymer resin. In an embodiment, for example, the first and second baselayers 101 and 103 may include a polymer resin such as polyethersulfone(“PES”), polyarylate (“PAR”), polyetherimide (“PEI”), polyethylenenaphthalate (“PEN”), polyethylene terephthalate (“PET”), polyphenylenesulfide (“PPS”), polyimide (“PI”), polycarbonate (“PC”), cellulosetriacetate (“TAC”), and cellulose acetate propionate (“CAP”). Thepolymer resin may be transparent.

Each of the first and second inorganic layers 102 and 104 may include abarrier layer configured to reduce or effectively prevent penetration ofexternal foreign substances and include a single layer structure or amulti-layer structure including an inorganic material such as SiNxand/or SiOx.

A buffer layer 201 configured to reduce or effectively preventimpurities from penetrating into a semiconductor layer of a thin filmtransistor may be arranged on the substrate 100. Referring to FIG. 14,the buffer layer 201 may be arranged on the semiconductor layer of athin film transistor TFT. The buffer layer 201 may include an inorganicinsulating material such as silicon nitride or silicon oxide and mayinclude a single layer structure or a multi-layer structure. In anembodiment, the second inorganic layer 104 of the substrate 100 may beunderstood as a portion of the buffer layer 201, which is a multi-layerstructure.

A pixel circuit (refer to PC in FIG. 4, for example) including the thinfilm transistor TFT and a storage capacitor Cst may be arranged on thebuffer layer 201.

The storage capacitor Cst includes a lower electrode CE1 and an upperelectrode CE2 that overlap each other with a first interlayer insulatinglayer 205 therebetween. The storage capacitor Cst may overlap the thinfilm transistor TFT. With regard to this, FIG. 14 shows a gate electrodeof the thin film transistor TFT serves as the lower electrode CE1 of thestorage capacitor Cst. In another embodiment, the storage capacitor Cstmay not overlap the thin film transistor TFT. The storage capacitor Cstmay be covered by a second interlayer insulating layer 207. A gateinsulating layer 203 may be disposed between the lower electrode CE1 andthe semiconductor layer of the thin film transistor TFT

The first and second interlayer insulating layers 205 and 207 mayinclude an inorganic insulating layer such as silicon oxide, siliconnitride, silicon oxynitride, aluminum oxide, titanium oxide, tantalumoxide, and hafnium oxide. The first and second interlayer insulatinglayers 205 and 207 may include a single layer structure or a multi-layerstructure including the above-mentioned materials.

The pixel circuit including the thin film transistor TFT and the storagecapacitor Cst is covered by an organic insulating layer 209. The organicinsulating layer 209 may include a planarization insulating layer. Theorganic insulating layer 209 may include an organic insulating materialincluding an imide-based polymer, a general-purpose polymer such as,polymethylmethacrylate (“PMMA”) and polystyrene (“PS”), polymerderivatives having a phenol-based group, an acryl-based polymer, animide-based polymer, an aryl ether-based polymer, an amide-basedpolymer, a fluorine-based polymer, a p-xylene-based polymer, a vinylalcohol-based polymer, or a blend thereof. In an embodiment, the organicinsulating layer 209 may include polyimide.

A display element, for example, an organic light-emitting diode isarranged on the organic insulating layer 209. A pixel electrode 221 ofthe organic light-emitting diode may be arranged on the organicinsulating layer 209 and may be connected to the pixel circuit through acontact hole in the organic insulating layer 209.

The pixel electrode 221 may include a conductive oxide material such asindium tin oxide (“ITO”), zinc oxide (“IZO”), zinc oxide (ZnO), indiumoxide (In₂O₃), indium gallium oxide (IGO), or aluminum zinc oxide (AZO).In another embodiment, the pixel electrode 221 may include a reflectivematerial layer including Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, and/ora compound thereof. In another embodiment, the pixel electrode 221 mayfurther include a layer including ITO, IZO, ZnO, or In₂O₃ on/under thereflective layer.

A pixel-defining layer 211 includes an opening at which a top surface ofthe pixel electrode 221 is exposed and covers an edge of the pixelelectrode 221. The pixel-defining layer 211 may include an organicinsulating material. Alternatively, the pixel-defining layer 211 mayinclude an inorganic insulating material or include an organic andinorganic insulating material.

An intermediate layer 222 includes an emission layer. The emission layermay include a polymer or relatively low molecular organic material thatemits light of a predetermined color. In an embodiment, the intermediatelayer 222 may include a first functional layer under the emission layerand/or a second functional layer over the emission layer.

The first functional layer may include a single layer structure or amulti-layer structure. In an embodiment, for example, in the case wherethe first functional layer includes a polymer material, the firstfunctional layer includes a hole transport layer (“HTL”), which has asingle-layered structure, and may include poly-(3,4)-ethylene-dihydroxythiophene (“PEDOT”) or polyaniline (“PANI”). In the case where the firstfunctional layer includes a relatively low molecular material, the firstfunctional layer may include a hole injection layer (“HIL”) and an HTL.

The second functional layer may be omitted. In an embodiment, forexample, in the case where the first functional layer and the emissionlayer include a polymer material, the second functional layer may beprovided to improve the organic light-emitting diode. The secondfunctional layer may be a single layer structure or a multi-layerstructure. The second functional layer may include an electron transportlayer (“ETL”) and/or an electron injection layer (“EIL”).

Some of the layers constituting the intermediate layer 222, for example,the functional layers may be arranged in not only the display area DAbut also the first non-display area NDA1. Portions of the overall layersarranged in both the display area DA and the first non-display area NDA1are disconnected from each other at the first non-display area NDA1 bythe first to fifth grooves G1, G2, G3, G4, and G5 described below.

An opposite electrode 223 is arranged to face the pixel electrode 221with the intermediate layer 222 therebetween. The opposite electrode 223may include a conductive material having a relatively low work function.In an embodiment, for example, the opposite electrode 223 may include a(semi) transparent layer including Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir,Cr, Li, Ca, and/or an ally thereof. Alternatively, the oppositeelectrode 223 may further include a layer including ITO, IZO, ZnO, orIn₂O₃ on the (semi) transparent layer including the above-mentionedmaterial.

The display element may be covered by a thin-film encapsulation layer230 and protected by external foreign substances or moisture. Thethin-film encapsulation layer 230 is arranged on the opposite electrode223. The thin-film encapsulation layer 230 may include at least oneorganic encapsulation layer and at least one inorganic encapsulationlayer. FIG. 14 shows that the thin-film encapsulation layer 230 includesfirst and second inorganic encapsulation layers 231 and 233 and anorganic encapsulation layer 232 which is arranged therebetween. Inanother embodiment, the number of and a stacked sequence of organicencapsulation layers and inorganic encapsulation layers within thethin-film encapsulation layer 230 may change.

The first and second inorganic encapsulation layers 231 and 233 mayinclude one or more inorganic insulating materials including aluminumoxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide,silicon oxide, silicon nitride, and/or silicon oxynitride. In anembodiment of manufacturing a display device, the first and secondinorganic encapsulation layers 231 and 233 may be formed by chemicalvapor deposition (“CVD”). The organic encapsulation layer 232 mayinclude a polymer-based material. The polymer-based material may includeacrylic-based resin, epoxy-based resin, polyimide, and polyethylene.

The input sensing layer (refer to 40 in FIG. 2) is arranged on thethin-film encapsulation layer 230. With regard to this, among elementsof the input sensing layer FIG. 14 shows the first sensing electrode 410arranged on the thin-film encapsulation layer 230. As described abovewith reference to FIGS. 9B_1, 9B_2 and 9B_3, the first sensing electrode410 includes a hole 410H corresponding to the emission area P-E of apixel. The organic light-emitting diode described for FIG. 14 maycorrespond to the emission area P-E of the pixel. As described abovewith reference to FIG. 11, an end 410E of the first sensing electrode410 over the organic light-emitting diode that neighbors the openingarea OA may extend to the first non-display area NDA1. The end 410E ofthe first sensing electrode 410 may terminate at the first non-displayarea NDA1 without being limited thereto. Though the FIG. 14 shows thefirst sensing electrode 410 for convenience of illustration, the presentdisclosure is not limited thereto. The second sensing electrode and/orfirst and second connection electrodes may also be located in thedisplay area DA.

The first non-display area NDA1 of FIG. 14 is described.

Referring to the first non-display area NDA1 of FIG. 14, the firstnon-display area NDA1 may include a first sub non-display area SNDA1 anda second sub non-display area SNDA2 that is disposed closer to theopening area OA than the first sub non-display area SNDA1.

The first sub non-display area SNDA1 is an area across which signallines pass. As signal lines, the data lines DL and the scan lines SL ofthe first sub non-display area SNDA1 in FIG. 14 may correspond to thedata lines that detour around the opening area OA described withreference to FIG. 5. The first sub non-display area SNDA1 may be awiring area or a detour area across which signal lines pass. Signallines may not be disposed in the second sub non-display area SNDA2.

The second sub non-display area SNDA2 is an overall groove area in whichgrooves are arranged. FIG. 14 shows the first to fifth grooves G1, G2,G3, G4, and G5 arranged in the second sub non-display area SNDA2. Eachof the first to fifth grooves G1, G2, G3, G4, and G5 may have anundercut structure. The first to fifth grooves G1, G2, G3, G4, and G5may be defined or formed in a multi-layer structure including aninorganic layer and an organic layer. In an embodiment, for example, thefirst to third grooves G1, G2, and G3 may be formed by removing aportion of multiple layers within the substrate 100 including aplurality of layers.

In an embodiment of manufacturing a display device, each of the first tofifth grooves G1, G2, G3, G4, and G5 may be formed by etching the secondbase layer 103 of the substrate 100 and the second inorganic layer 104thereon. With regard to this, FIG. 14 shows that the first to fifthgrooves G1, G2, G3, G4, and G5 are formed by removing a portion of thesecond base layer 103 and a portion of the second inorganic layer 104.FIG. 14 shows that the buffer layer 201 on the second inorganic layer104 is simultaneously removed with the second inorganic layer 104.Though the buffer layer 201 and the second inorganic layer 104 havedifferent names with reference to FIG. 14, the buffer layer 201 may beunderstood as one of the layers included in the second inorganic layer104 which is a multi-layer structure, or the second inorganic layer 104may be understood as one of the layers included in the buffer layer 201,which is a multi-layer structure.

Each of the first to fifth grooves G1, G2, G3, G4, and G5 may have anundercut structure in which a width along the x-direction of a portionthereof that passes through the second base layer 103 is greater than awidth along the x-direction of a portion thereof that passes through thesecond inorganic layer 104 and/or the buffer layer 201. Through theundercut structure of the first to fifth grooves G1, G2, G3, G4, and G5,a portion 222′ (e.g., the first and/or second functional layers) of theintermediate layer 222 and the opposite electrode 223 may bedisconnected from other portions thereof. With regard to this, it isshown that each of the portion 222′ of the intermediate layer 222 andthe opposite electrode 223 within the first to fifth grooves G1, G2, G3,G4, and G5 is disconnected (or separated) from other portions of theintermediate layer 222 and the opposite electrode 223 around the firstto fifth grooves G1, G2, G3, G4, and G5.

The first inorganic encapsulation layer 231 of the thin-filmencapsulation layer 230 may cover an inner surface of the first to fifthgrooves G1, G2, G3, G4, and G5. The organic encapsulation layer 232 maycover the first groove G1 and at least partially fill the first grooveG1 on the first inorganic encapsulation layer 231.

In an embodiment of manufacturing a display device, the organicencapsulation layer 232 may be formed by coating a monomer material overthe substrate 100 and hardening the monomer. To control a flow of themonomer material and secure a thickness of the monomer material (or theorganic encapsulation layer 232), a partition wall 510 may be providedbetween the first and second grooves G1 and G2. The partition wall 510may include an organic insulating material.

In an embodiment, during a process of forming the organic encapsulationlayer 232, a portion of the material for forming the organicencapsulation layer 232 may remain in some of the grooves. With regardto this, FIG. 14 shows that there is an organic material 232A in thesecond and fourth grooves G2 and G4.

The second inorganic encapsulation layer 233 may be arranged on theorganic encapsulation layer 232 and may directly contact the firstinorganic encapsulation layer 231 at the second to fifth grooves G2, G3,G4, and G5.

A planarization layer 600 may be located in the second sub non-displayarea SNDA2 to cover at least one groove. In an embodiment, for example,the planarization layer 600 may commonly cover the first to fifthgrooves G1, G2, G3, G4, and G5. The planarization layer 600 may coverthe second to fifth grooves G2, G3, G4, and G5 and at least partiallyfill at least one of the second to fifth grooves G2, G3, G4, or G5. Asshown in FIG. 14, spaces of the second to fifth grooves G2, G3, G4, andG5 on the second inorganic encapsulation layer 233 may be filled withthe planarization layer 600.

The planarization layer 600 may increase flatness of the display panel10 around the opening area OA by covering an area of the second subnon-display area SNDA2 that is not covered by the organic encapsulationlayer 232. The planarization layer 600 may include an organic insulatingmaterial. When elements such as a reflection prevention member and/or awindow are arranged on the display panel 10 (refer to 50 and 60 in FIG.2), the planarization layer 600 may reduce or effectively preventseparation or floating of those elements from the display panel 10, orimproper coupling of those elements to the display panel 10.

The planarization layer 600 may extend from the second sub non-displayarea SNDA2 to be disposed on the thin-film encapsulation layer 230 andmay be spatially separated from the organic encapsulation layer 232 bythe second inorganic encapsulation layer 233. In an embodiment, forexample, since the planarization layer 600 is arranged on the secondinorganic encapsulation layer 233, and the organic encapsulation layer232 is arranged under the second inorganic encapsulation layer 233, theorganic encapsulation layer 232 and the planarization layer 600 may bespatially separated from each other. The organic encapsulation layer 232and the planarization layer 600 may not directly contact each other. Theplanarization layer 600 may have a thickness of about 5 micrometers (μm)or more.

The metal layer 30 (see FIG. 11) may be arranged on the planarizationlayer 600. With regard to this, FIG. 14 shows the first segment 310which is a portion of the metal layer 30. The first segment 310, thatis, the metal layer 30 may cover signal lines (e.g. the data line DL andthe scan line SL) arranged in the first non-display area NDA1.

As described above with reference to FIG. 6, a radial width of the metallayer 30, for example, the first segment 310 may be less than a radialwidth of the first non-display area NDA1. Though FIG. 14 shows that themetal layer 30, for example, the first segment 310 does not overlap thefirst to fifth grooves G1, G2, G3, G4, and G5, the present disclosure isnot limited thereto. In another embodiment, the metal layer 30, forexample, the first segment 310 may overlap and cover at least onegroove.

FIG. 15 is an enlarged top plan view of another embodiment of a portionof a display device 1′ and FIG. 16 is an enlarged top plan view of themetal layer 30 and the input sensing layer 40 of the display device 1′of FIG. 15.

Though the display device 1 described with reference to FIG. 3 hasdescribed that the opening area OA is entirely surrounded by the displayarea DA, the present disclosure is not limited thereto. As shown in FIG.15, in a display device 1′, the opening area OA may be partiallysurrounded by the display area DA. In this case, the first non-displayarea NDA1 that surrounds the opening area OA may be connected to thesecond non-display area NDA2 that extends along an edge of the substrate100.

Referring to FIG. 16, the metal layer 30 is arranged in the firstnon-display area NDA1 that surrounds the opening area OA. The metallayer 30 may include a plurality of segments. In an embodiment, forexample, as shown in FIG. 16, first to third segments 310″, 320″, and330″ are shown. The metal layer 30 shown in FIG. 16 may have the samestructure and/or features as those of the embodiment described abovewith reference to FIGS. 6 to 14 with only differences in the number ofsegments.

In one or more embodiment, the metal layer 30 may reduce or effectivelyprevent a wiring that neighbors the opening area OA or the opening frombeing unexpectedly externally viewed. The metal layer 30 that neighborsthe opening area OA or the opening may also reduce or effectivelyprevent reduction of a touch sensitivity at the opening area OA or inthe vicinity of the opening.

Although the disclosure has been described with reference to theembodiments illustrated in the drawings, this is merely provided as anexample and it will be understood by those of ordinary skill in the artthat various changes in form and details and equivalents thereof may bemade therein without departing from the spirit and scope of thedisclosure as defined by the following claims.

What is claimed is:
 1. A display device comprising: a substrateincluding a first area, a second area adjacent to the first area, and athird area between the first area and the second area; a display elementwith which an image is displayed, on the substrate in the second areathereof; and a metal layer including a plurality of segments spacedapart from each other, each segment disposed in the third area.
 2. Thedisplay device of claim 1, wherein the metal layer includes a metalhaving a light-blocking characteristic.
 3. The display device of claim1, wherein the plurality of segments are spaced apart from each otheralong an outer edge of the first area.
 4. The display device of claim 1,further comprising a signal wiring portion being in the third area, thesignal wiring portion interposed between the metal layer and thesubstrate.
 5. The display device of claim 4, further comprising a scansignal line or a data signal line connected to the display element inthe second area, wherein the scan signal line or the data signal lineextends from the second area to dispose a portion of the scan signalline or the data signal line in the third area, and the portion of thescan signal line or the data signal line in the third area defines thesignal wiring portion in the third area.
 6. The display device of claim1, further comprising an input sensing layer on the display element, theinput sensing layer including: first sensing electrodes arranged along afirst direction, and second sensing electrodes arranged along a seconddirection which intersects with the first direction.
 7. The displaydevice of claim 6, wherein the metal layer and the first sensingelectrodes are respectively portions of a same material layer, or themetal layer and the second sensing electrodes are respectively portionsof a same material layer.
 8. The display device of claim 6, wherein theplurality of segments of the metal layer include: a first segmentelectrically connected to one of the first sensing electrodes; and asecond segment electrically connected to one of the second sensingelectrodes.
 9. The display device of claim 8, wherein, the first segmentof the metal layer is closer to the first sensing electrode than thesecond sensing electrode.
 10. A display device comprising: a substrateincluding a display area in which are defined: an opening; and anon-display area between the opening and the display area; a pluralityof display elements in the display area and including a first displayelement and a second display element which are spaced apart each otherwith the opening therebetween; a signal wiring in the non-display area,the signal wiring electrically connected to the first and second displayelements; and a metal layer in the non-display area.
 11. The displaydevice of claim 10, wherein the metal layer at least partiallyoverlapping the signal wiring in the non-display area.
 12. The displaydevice of claim 10, wherein the metal layer includes a plurality ofsegments arranged spaced apart from each other along an outer edge ofthe opening.
 13. The display device of claim 10, further comprising aninput sensing layer on the display elements, the input sensing layerincluding: first sensing electrodes arranged along a first direction,and second sensing electrodes arranged along a second direction whichintersects with the first direction.
 14. The display device of claim 13,wherein the metal layer and the first sensing electrodes arerespectively portions of a same material layer, or the metal layer andthe second sensing electrodes are respectively portions of a samematerial layer.
 15. A display device comprising: a substrate including adisplay area in which are defined: an opening; and a non-display areabetween the opening and the display area; a plurality of displayelements in the display area; an input sensing layer on the displayelements; and a metal layer in the non-display area.
 16. The displaydevice of claim 15, wherein the input sensing layer includes: firstsensing electrodes arranged along a first direction, and second sensingelectrodes arranged along a second direction which intersects with thefirst direction, and the metal layer includes a segment in thenon-display area, the segment connected to one of the first sensingelectrodes or one of the second sensing electrodes.
 17. The displaydevice of claim 16, wherein the metal layer includes a plurality ofsegments in the non-display area.
 18. The display device of claim 17,wherein a first sensing electrode among the first sensing electrodes anda second sensing electrode among the second sensing electrodes arearranged adjacent to each other along the opening, the plurality ofsegments of the metal layer includes: a first segment connected to thefirst sensing electrode, and a second segment connected to the secondsensing electrode.
 19. The display device of claim 17, wherein theplurality of segments are spaced apart from each other along an outeredge of the opening.
 20. The display device of claim 15, wherein themetal layer and the input sensing layer are respective portions of asame material layer.